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3-DIMENSIONAL VLSI

Deng

Oprawa:
TWARDA

Wydawca:
Springer Berlin Heidelberg

ISBN:
9783642041563

678,26 PLN
Wysyłamy w 28 dni

Opis produktu

''3Dimensional VLSI: A 2.5Dimensional Integration Schemeelaborates the concept and importance of 3Dimensional (3D) VLSI. The authors have developed a new 3D IC integration paradigm socalled 2.5D integration to address many problems that are hard to resolve using traditional nonmonolithic integration schemes. The book also introduces major 3D VLSI design issues that need to be solved by IC designers and Electronic Design Automation (EDA) developers. By treating 3D integration in an integrated framework the book provides important insights for semiconductor process engineers IC designers and those working in EDA R&:D.'/'''Dr. Yangdong Deng is an associate professor at the Institute of Microelectronics Tsinghua University China. Dr. Wojciech P. Maly is the U. A. and Helen Whitaker Professor at the Department of Electrical and Computer Engineering Carnegie Mellon University''3Dimensional VLSI presents a new integration scheme designed for problems that are difficult to solve with traditional nonmonolithic integration schemes. Major 3D VLSI design issues are also introduced within an integrated fram''3Dimensional VLSI: A 2.5Dimensional Integration Schemeelaborates the concept and importance of 3Dimensional (3D) VLSI. The authors have developed a new 3D IC integration paradigm socalled 2.5D integration to address many problems that are hard to resolve using traditional nonmonolithic integration schemes. The book also introduces major 3D VLSI design issues that need to be solved by IC designers and Electronic Design Automation (EDA) developers. By treating 3D integration in an integrated framework the book provides important insights for semiconductor process engineers IC designers and those working in EDA R&:D.'/'''Dr. Yangdong Deng is an associate professor at the Institute of Microelectronics Tsinghua University China. Dr. Wojciech P. Maly is the U. A. and Helen Whitaker Professor at the Department of Electrical and Computer Engineering Carnegie Mellon UniversityA Cost Comparison of VLSI Integration Schemes. Design Case Studies. An Automatic 2.5D Layout Design Flow. Floorplanning for 2.5D Integration. Placement for 2.5D Integration. A Road map of 2.5D Integration. Conclusion''A new integration scheme considering both performance and yield'/'''Novel cost model to compare difference integration styles'/'''Design driven approach to prove the performance advantages of 2.5/3D ICs'/'''Full EDA tool support for 3D layout cr

Wymiary: 155 mm 235 mm

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Ostatnia aktualizacja:

21-11-2019

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