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A PRIORI WIRE LENGTH ESTIMATES FOR DIGITAL DESIGN

Stroobandt

Oprawa:
MIĘKKA

Wydawca:
Springer US

ISBN:
9781461346326

638,36 PLN
Wysyłamy w 28 dni

Opis produktu

The roots of this book and of the new research field that it defines lie in the scaling of VLSI technology. With gigahertz system clocks and ever accelerating design and process innovations interconnects have become the limiting factor for both performance and density. This increasing impact of interconnects on the system implementation space necessitates new tools and analytic techniques to support the system designer. With respect to modeling and analysis the response to interconnect dom inance is evolutionary. Atomistic and grainlevel models of interconnect structure and performance models at multigigahertz operating frequencies together guide the selection of improved materials and process technologies (e. g. damascene copper wires lowpermittivity dielectrics). Previously in significant effects (e. g. mutual inductance) are added into performance mod els as older approximations (e. g. lumpedcapacitance gate load models) are discarded. However at the systemlevel and chip planning level the necessary response to interconnect dominance is revolutionary. Convergent design flows do not require only distributed RLC line models repeater awareness unifi cations with extraction and analysis etc. Rather issues such as wiring layer assignment and early prediction of the resource and performance envelope for the system interconnect (in particular based on statistical models of the system interconnect structure) also become critical. Indeed systemlevel interconnect prediction has emerged as the enabler of improved interconnect modeling more costeffective system architectures and more productive deThe roots of this book and of the new research field that it defines lie in the scaling of VLSI technology. With gigahertz system clocks and ever accelerating design and process innovations interconnects have become the limiting factor for both performance and density. This increasing impact of interconnects on the system implementation space necessitates new tools and analytic techniques to support the system designer. With respect to modeling and analysis the response to interconnect dom inance is evolutionary. Atomistic and grainlevel models of interconnect structure and performance models at multigigahertz operating frequencies together guide the selection of improved materials and process technologies (e. g. damascene copper wires lowpermittivity dielectrics). Previously in significant effects (e. g. mutual inductance) are added into performance mod els as older approximations (e. g. lumpedcapacitance gate load models) are discarded. However at the systemlevel and chip planning level the necessary response to interconnect dominance is revolutionary. Convergent design flows do not require only distributed RLC line models repeater awareness unifi cations with extraction and analysis etc. Rather issues such as wiring layer assignment and early prediction of the resource and performance envelope for the system interconnect (in particula

Wymiary: 504 gr 160 mm 240 mm

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